Data hall with liquid cooling

Microfluidic cooling: cooling channels directly in the silicon

The next step after cold plates may be to bring the coolant into the chip itself. In the lab, Microsoft has shown that cooling channels etched into the silicon remove heat significantly better. The technology is still far from commercial use.

What the development involves

In microfluidic cooling, very small channels are etched directly into the silicon so that the coolant passes close to the parts of the chip where heat is generated (Microsoft, September 2025).

What benefits are documented

Microsoft reports up to three times better heat removal than cold plates and up to 65% lower maximum temperature rise in a GPU. The results come from laboratory tests.

What it could mean in Sweden

Relevance for projects being built today is low. The technology does show, however, that power per chip will continue to rise, and that facilities must be able to handle even denser IT loads in the future.

What needs to be investigated

Nothing at present. We are monitoring developments and how they may affect temperature and flow requirements in the facility's cooling system in the longer term.

Site, heat or capacity

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